Removal/Installation of BGA Components
Using dedicated rework equipment! We can flexibly accommodate packages with strict conditions.
We would like to introduce the "Removal/Installation of BGA Components" conducted by Ruiling Electric Co., Ltd. In recent years, BGA (Ball Grid Array) components for memory and ASICs have become mainstream, and it is very difficult to remove/install these components with conventional tools. Our company uses dedicated rework equipment and manages temperature through temperature profiles, allowing us to flexibly handle not only standard BGAs but also packages with strict conditions, such as POP. Additionally, by using rework equipment, we have improved the reliability of the removal/installation of these components. 【Features】 ■ Use of dedicated rework equipment ■ Flexible response to packages with strict conditions ■ Improved reliability of removal/installation of these components through the use of rework equipment *For more details, please refer to the PDF document or feel free to contact us.
- Company：瑞菱電機 ずいりょうでんき
- Price：Other
